Removal of barrier and liner layers from a bottom of a via

ABSTRACT

A method for manufacturing a semiconductor device includes forming an interconnect in a first dielectric layer, and forming a second dielectric layer on the first dielectric layer. In the method, an etch stop layer is formed on the second dielectric layer, and a third dielectric layer is formed on the etch stop layer. A trench and an opening are formed in the third and second dielectric layers, respectively. A barrier layer is deposited in the trench and in the opening, and on a top surface of the interconnect. The method also includes removing the barrier layer from the top surface of the interconnect and from a bottom surface of the trench, and depositing a conductive fill layer in the trench and in the opening, and on the interconnect. A bottom surface of the trench includes the etch stop layer.

BACKGROUND

Barrier and liner materials in vias cause high resistances in, forexample, middle-of-line (MOL) and back-end-of-line (BEOL) structures.Etch-back processes to remove barrier and liner materials from a bottomportion of a via opening cause unwanted removal of the barrier and linermaterials from bottom portions of conductive line trenches. Thisunwanted removal of the barrier and liner layers leads to metaldiffusion into dielectric layers under the conductive line trenches,which adversely affects device reliability.

In addition, reactive ion etching (ME) processes when forming trenchesfor structures such as, for example, source/drain contacts, gatecontacts, and other contacts, may result in trenches with non-uniformdepths, which causes unwanted resistance and capacitance (RC)variations. Variations in trench depth can occur, for example, betweennarrow and wide lines due to ME lag.

SUMMARY

According to an exemplary embodiment of the present invention, a methodfor manufacturing a semiconductor device includes forming aninterconnect in a first dielectric layer, and forming a seconddielectric layer on the first dielectric layer. In the method, an etchstop layer is formed on the second dielectric layer, and a thirddielectric layer is formed on the etch stop layer. A trench and anopening are formed in the third and second dielectric layers,respectively. A barrier layer is deposited in the trench and in theopening, and on a top surface of the interconnect. The method alsoincludes removing the barrier layer from the top surface of theinterconnect and from a bottom surface of the trench, and depositing aconductive fill layer in the trench and in the opening, and on theinterconnect. A bottom surface of the trench includes the etch stoplayer.

According to an exemplary embodiment of the present invention, asemiconductor device includes a first interconnect disposed in a firstdielectric layer, a second dielectric layer disposed on the firstdielectric layer, and a third dielectric layer disposed on the seconddielectric layer. A second interconnect is disposed in a trench in thethird dielectric layer, and includes a first portion of a conductivefill layer. A bottom surface of the trench includes an etch stop layerincluding a conductive material. The etch stop layer is disposed betweenthe first portion of the conductive fill layer and the second dielectriclayer. The semiconductor device also includes a via disposed in thesecond dielectric layer. The via includes a second portion of theconductive fill layer, and connects the second interconnect to the firstinterconnect. The second portion of the conductive fill layer isdisposed on the first interconnect.

According to an exemplary embodiment of the present invention, a methodfor manufacturing a semiconductor device includes forming an etch stoplayer on a first dielectric layer, and forming a second dielectric layeron the etch stop layer. In the method, the second dielectric layer isetched down to the etch stop layer to form a trench in the seconddielectric layer. A bottom surface of the trench includes the etch stoplayer. The first dielectric layer is etched to form an opening in thefirst dielectric layer under the trench. The etching of the firstdielectric layer exposes a top surface of an interconnect under theopening. The method further includes depositing a barrier layer in thetrench and in the opening, and on the top surface of the interconnect.The barrier layer is removed from the top surface of the interconnectand from a bottom surface of the trench. A conductive fill layer isdeposited in the trench and in the opening, and on the interconnect.

These and other exemplary embodiments of the invention will be describedin or become apparent from the following detailed description ofexemplary embodiments, which is to be read in connection with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

Exemplary embodiments of the present invention will be described belowin more detail, with reference to the accompanying drawings, of which:

FIG. 1 is a cross-sectional view illustrating fabrication of asemiconductor device, and showing formation of a lower levelmetallization layer, according to an exemplary embodiment of the presentinvention.

FIG. 2 is a cross-sectional view illustrating fabrication of asemiconductor device, and showing cap layer, dielectric layer and etchstop layer formation, according to an exemplary embodiment of thepresent invention.

FIG. 3 is a cross-sectional view illustrating fabrication of asemiconductor device, and showing upper level metallization trench andvia opening formation, according to an exemplary embodiment of thepresent invention.

FIG. 4 is a cross-sectional view illustrating fabrication of asemiconductor, and showing formation of barrier and liner layers,according to an exemplary embodiment of the present invention.

FIG. 5 is a cross-sectional view illustrating fabrication of asemiconductor device, and showing barrier and liner layer etch back,according to an exemplary embodiment of the present invention.

FIG. 6 is a cross-sectional view illustrating fabrication of asemiconductor, and showing formation of a conductive fill layer,according to an exemplary embodiment of the present invention.

FIG. 7 is a cross-sectional view illustrating fabrication of asemiconductor device, and showing dielectric layer removal, according toan exemplary embodiment of the present invention.

FIG. 8 is a cross-sectional view illustrating fabrication of asemiconductor device, and showing removal of exposed portions of theetch stop layer, according to an exemplary embodiment of the presentinvention.

FIG. 9 is a cross-sectional view illustrating fabrication of asemiconductor device, and showing dielectric layer formation andplanarization, according to an exemplary embodiment of the presentinvention.

FIG. 10 is a cross-sectional view illustrating fabrication of asemiconductor device, and showing formation of barrier layer, accordingto an exemplary embodiment of the present invention.

FIG. 11 is a cross-sectional view illustrating fabrication of asemiconductor device, and showing barrier layer etch back, according toan exemplary embodiment of the present invention.

FIG. 12 is a cross-sectional view illustrating fabrication of asemiconductor device, and showing formation of a liner layer, accordingto an exemplary embodiment of the present invention.

FIG. 13 is a cross-sectional view illustrating fabrication of asemiconductor, and showing formation of a conductive fill layer,according to an exemplary embodiment of the present invention.

FIG. 14 is a cross-sectional view illustrating fabrication of asemiconductor device, and showing dielectric layer removal, according toan exemplary embodiment of the present invention.

FIG. 15 is a cross-sectional view illustrating fabrication of asemiconductor device, and showing removal of exposed portions of theetch stop layer, according to an exemplary embodiment of the presentinvention.

FIG. 16 is a cross-sectional view illustrating fabrication of asemiconductor device, and showing dielectric layer formation andplanarization, according to an exemplary embodiment of the presentinvention.

DETAILED DESCRIPTION

Exemplary embodiments of the invention will now be discussed in furtherdetail with regard to semiconductor devices and methods of manufacturingsame and, in particular, to the use of a metallic etch stop layer as adiffusion barrier and to form trenches having a uniform depth.

It is to be understood that the various layers and/or regions shown inthe accompanying drawings are not drawn to scale, and that one or morelayers and/or regions of a type commonly used in, for example,complementary metal-oxide semiconductor (CMOS), fin field-effecttransistor (FinFET), metal-oxide-semiconductor field-effect transistor(MOSFET), programmable logic devices (PLDs), programmable gate arrays,programmable read-only memory (PROM) devices, including, but not limitedto, erasable programmable read-only memories (EPROMS), electronicallyerasable programmable read-only memories (EEPROMS), and/or othersemiconductor devices, may not be explicitly shown in a given drawing.This does not imply that the layers and/or regions not explicitly shownare omitted from the actual devices. In addition, certain elements maybe left out of particular views for the sake of clarity and/orsimplicity when explanations are not necessarily focused on the omittedelements. Moreover, the same or similar reference numbers usedthroughout the drawings are used to denote the same or similar features,elements, or structures, and thus, a detailed explanation of the same orsimilar features, elements, or structures will not necessarily berepeated for each of the drawings.

The semiconductor devices and methods for forming same in accordancewith embodiments of the present invention can be employed inapplications, hardware, and/or electronic systems. Suitable hardware andsystems for implementing embodiments of the invention may include, butare not limited to, personal computers, communication networks,electronic commerce systems, portable communications devices (e.g., celland smart phones), solid-state media storage devices, functionalcircuitry, etc. Systems and hardware incorporating the semiconductordevices are contemplated embodiments of the invention. Given theteachings of embodiments of the invention provided herein, one ofordinary skill in the art will be able to contemplate otherimplementations and applications of embodiments of the invention.

The embodiments of the present invention can be used in connection withsemiconductor devices that may require, for example, CMOSs, MOSFETs,FinFETs, PLDs, programmable gate arrays, PROMS, EPROMS, and/or EEPROMS.By way of non-limiting example, the semiconductor devices can include,but are not necessarily limited to CMOS, MOSFET, FinFET, PLD,programmable gate array, PROM, EPROM, and/or EEPROM devices, and/orsemiconductor devices that use CMOS, MOSFET, FinFET, PLD, programmablegate array, PROM, EPROM, and/or EEPROM technology.

As used herein, “height” refers to a vertical size of an element (e.g.,a layer, trench, hole, opening, etc.) in the cross-sectional viewsmeasured from a bottom surface to a top surface of the element, and/ormeasured with respect to a surface on which the element is located.Conversely, a “depth” refers to a vertical size of an element (e.g., alayer, trench, hole, opening, etc.) in the cross-sectional viewsmeasured from a top surface to a bottom surface of the element. Termssuch as “thick”, “thickness”, “thin” or derivatives thereof may be usedin place of “height” where indicated.

As used herein, “lateral,” “lateral side,” “lateral surface” refers to aside surface of an element (e.g., a layer, opening, etc.), such as aleft or right side surface in the drawings.

As used herein, “width” or “length” refers to a size of an element(e.g., a layer, trench, hole, opening, etc.) in the drawings measuredfrom a side surface to an opposite surface of the element. Terms such as“thick”, “thickness”, “thin” or derivatives thereof may be used in placeof “width” or “length” where indicated.

As used herein, terms such as “upper”, “lower”, “right”, “left”,“vertical”, “horizontal”, “top”, “bottom”, and derivatives thereof shallrelate to the disclosed structures and methods, as oriented in thedrawing figures. For example, as used herein, “vertical” refers to adirection perpendicular to the top surfaces of the dielectric layers inthe cross-sectional views, and “horizontal” refers to a directionparallel to the top surfaces of the dielectric layers in thecross-sectional views.

As used herein, unless otherwise specified, terms such as “on”,“overlying”, “atop”, “on top”, “positioned on” or “positioned atop” meanthat a first element is present on a second element, wherein interveningelements may be present between the first element and the secondelement. As used herein, unless otherwise specified, the term “directly”used in connection with the terms “on”, “overlying”, “atop”, “on top”,“positioned on” or “positioned atop” or the term “direct contact” meanthat a first element and a second element are connected without anyintervening elements, such as, for example, intermediary conducting,insulating or semiconductor layers, present between the first elementand the second element.

As used herein, “low-k” refers to dielectric materials having a relativedielectric constant less than 7, and includes ultra-low-k dielectricmaterials.

As used herein, “high-k” refers to dielectric materials having arelative dielectric constant greater than 7.

There is a need for via and metallization layer structures and methodsof manufacturing same which allow for the elimination of barrier andliner layers at bottom portions of vias connecting contact structures,while maintaining a diffusion barrier at bottom portions of the contactstructures. In accordance with the embodiments, a metallic etch stoplayer functions as a diffusion barrier at the bottom of contacttrenches, and is used during manufacturing to form trenches with uniformdepths. As a result, via resistance is lowered without any concerns ofcontact metal diffusion into underlying dielectric layers. In addition,the embodiments result in the same trench depth regardless of trenchwidth, while preventing unwanted RC variability. The embodiments providecontact structures which avoid non-uniformity between trenches andprovides the low resistance benefits of barrier and liner layer removalfrom vias without unwanted metal diffusion into dielectric layers underconductive line trenches.

Referring to FIG. 1, a semiconductor device 100 includes an interconnectI1 formed in a first dielectric layer 101. The interconnect I1 includesa barrier layer 106 and liner layer 107 formed on the barrier layer 106.A fill layer 105 is formed on the liner layer 107. The barrier layer 106includes, for example, titanium nitride, tantalum nitride or tungstennitride and is conformally formed on sidewalls and a bottom surface of atrench in the first dielectric layer 101. The liner layer 107 includes,for example, cobalt and/or ruthenium and is conformally formed on thebarrier layer 106. The fill layer 105 includes, an electricallyconductive metal, such as, for example, tungsten, cobalt, zirconium,tantalum, titanium, aluminum, ruthenium, copper, metal carbides (e.g.,tantalum carbide, titanium carbide, tantalum magnesium carbide), metalnitrides (e.g., titanium nitride), transition metal aluminides orcombinations thereof. The interconnect I1 and the first dielectric layer101 can form at least part of a lower metallization level (M_(x)).

Interconnects, also referred to herein as wires or conductive lines,function as conductive contacts. Interconnects form electricalconnections between elements and/or devices, or form contacts toelements or devices. As used herein, an “interconnect” or “interconnectstructure” includes a conductive fill layer, and may further include abarrier layer and/or a liner layer.

The first dielectric layer 101 includes, for example, silicon dioxide(SiO₂), carbon-doped silicon oxide (SiCOH), SiLK® dielectrics, porousforms of these low-k dielectric films, flowable dielectrics and/orspin-on dielectrics. As can be understood by one of ordinary skill inthe art, the dielectric layer 101 can be on a semiconductor substrate(not shown), with intervening layers (e.g., lower conductive lines,devices, etc.) between the dielectric layer 101 and the substrate. Asemiconductor substrate may comprise semiconductor material including,but not limited to, Si, SiGe, SiC, SiGeC or other like semiconductor. Inaddition, multiple layers of the semiconductor materials can be used asthe semiconductor material of the substrate. A plurality of devices canbe on the substrate, such as, for example, transistors, capacitors, andresistors.

Referring to FIG. 2, a dielectric capping layer 102 comprising, forexample, NBLoK™ material or a nitride material (e.g., siliconcarbonitride (SiCN)), is formed on the first dielectric layer 101.NBLoK™ material is from Applied Materials, Inc. of Santa Clara, Calif.,and is a nitrogen-doped silicon carbide. As can be seen, the cappinglayer 102 is deposited on top surfaces of the dielectric layer 101 andthe interconnect I1.

A second dielectric layer 111 is formed on the dielectric capping layer102, and comprises, for example, the same material as or a similarmaterial to the first dielectric layer 101. The second dielectric layer111 is deposited using one or more deposition techniques, such as, butnot necessarily limited to, physical vapor deposition (PVD), chemicalvapor deposition (CVD), atomic layer deposition (ALD), plasma-enhancedCVD (PECVD), radio frequency CVD (RFCVD), molecular layer deposition(MLD), molecular beam deposition (MBD), liquid source misted chemicaldeposition (LSMCD) and/or sputtering.

An etch stop layer 103 is deposited on the second dielectric layer 111.The etch stop layer 103 includes for example, an electrically conductivemetal material such as, but not necessarily limited to, tantalum (Ta),tantalum nitride (TaN), Ta/TaN, Ta/Ruthenium (Ru), Ta/Cobalt (Co),TaN/Ru, TaN/Co, Ta/TaN/Ru, and/or Ta/TaN/Co. The etch stop layer 103 isdeposited using deposition techniques such as, but not necessarilylimited to, PVD, CVD, ALD, PECVD, RFCVD, MLD, MBD, LSMCD, and/orsputtering.

A third dielectric layer 121 is deposited on the etch stop layer 103.According to an embodiment, the third dielectric layer 121 comprises thesame or similar material as that of the first and second dielectriclayers 101 and 111, as long as the third dielectric layer 121 is able tobe selectively etched with respect to the etch stop layer 103. The thirddielectric layer 121 is deposited using, for example, PVD, CVD, ALD,PECVD, RFCVD, MLD, MBD, LSMCD, and/or sputtering. The etch stop layer103 permits complete removal of the third dielectric layer 121 down tothe etch stop layer 103, which permits formation of trenches in thedielectric layer 121 having each having bottom surfaces level with eachother such that the trenches have the same depth.

Referring to FIG. 3, portions of the third dielectric layer 121 (e.g.,portions not covered by a mask) are etched down to the etch stop layer103 to form an upper metallization level trench 124. Since the etch stoplayer 103 is not etched by the etchant used to remove the dielectriclayer 121 or, at the very least, is etched at a very slow rate withrespect to that of the dielectric layer 121, the exposed portion of thedielectric layer 121 can be completely removed to form the trench 124.For example, a representative selectivity ratio of the etch rate of thedielectric layer 121 with respect to that of the etch stop layer 103would be approximately 5:1. Due to the etch stop layer 103, all trenchesformed in the dielectric layer 121 can have a uniform depth. Accordingto an embodiment, the etching is performed using, for example, afluorocarbon based dry etch process or an ultra-violet (UV) damage andwet etch process.

A via opening 128 under the trench 124 is formed in the dielectric layer111. The via opening 128 is formed by removing a portion of the etchstop layer 103 and removing a portion of the dielectric layer 111 andthe capping layer 102. The portion of the etch stop layer 103 is removedusing, for example, an etch process with chlorine-based plasma orfluorine-based plasma, and the portion of the capping layer 102 isremoved using, for example, an etch process with fluorine-based plasma.Etching of the dielectric layer 111 is performed using, for example, aprocess similar to that to remove the dielectric layer 121. As shown inFIG. 3, the via opening 128 exposes a top surface of the fill layer 105.The via opening may also expose top surfaces of the barrier and/or linerlayers 106 and 107.

Referring to FIG. 4, the trench 124 and opening 128 are lined withbarrier and liner layers 126 and 127 the same as or similar to barrierand liner layers 106 and 107. For example, the barrier and liner layers126 and 127 can have the same material as or similar material to thebarrier and liner layers 106 and 107.

The barrier and liner layers 126 and 127 are conformally ornon-conformally formed on a top surface of the dielectric layer 121, andon sidewalls and bottom surfaces of the trench 124 and opening 128,including exposed surfaces of the capping layer 102, etch stop layer 103and dielectric layers 121 and 111, and on the exposed top surfaces ofthe interconnect I1 (e.g., on fill layer 105). The barrier and linerlayers 126 and 127 are deposited using, for example, a depositiontechnique, such as ALD, CVD or PVD.

Referring to FIG. 5, horizontal portions of the barrier and liner layers126 and 127 are removed in an etch back process. The etch back processcan be performed using, for example, a directional dry etch processcomprising argon sputtering. The etch back process removes portions ofthe barrier and liner layers 126 and 127 from top surfaces of thedielectric layer 121, the top surface of the etch stop layer 103 on thedielectric layer 111, and the from top surface of the interconnect I1,including the fill layer 105, exposing a top surface of the fill layer105. Although the barrier and liner layers 126 and 127 are removed fromthe top surface of the etch stop layer 103 on the dielectric layer 111,the etch stop layer 103, which is formed of a metallic material,remains. As a result, once a conductive fill layer (e.g., layer 125) isdeposited in the trench 124 on the etch stop layer 103, the metallicetch stop layer 103 can be a diffusion barrier to prevent diffusion ofthe material of fill layer (e.g., layer 125) into the dielectric layer111.

Referring to FIG. 6, the remaining portions of the trench 124 andopening 128 are filled with conductive fill layer 125, similar to filllayer 105. For example, the fill layer 125 can have the same material asor similar material to the fill layer 105. The fill layer 125 isdeposited on the exposed portions of the barrier and liner layers 126and 127, as well as on the exposed portions of the etch stop layer 103and the interconnect I1, including fill layer 105. The fill layer 125 isdeposited using deposition techniques, including, but not necessarilylimited to, PVD, CVD, ALD or sputtering.

Following deposition of the fill layer 125, a planarization process,such as, for example, CMP, is performed to remove portions of the filllayer 125 on the top surface of the dielectric layer 121 and extendingout of the trench 124 to planarize an upper surface of the device.

The circled portion in FIG. 6 illustrates the lack of a barrier layerand a liner layer at the bottom of the via V_(x), where the fill layer125 is deposited directly on the fill layer 105, with no interveningbarrier or liner layer. The removal of the liner and barrier layers fromthe bottom of the via V_(x) lowers the resistance as compared to whenthe liner and barrier layers are present, thereby improving deviceperformance. In a non-limiting example, eliminating TaN and Co barrierand liner layers at a bottom surface of a Cu via having a criticaldimension of about 5 nm reduces via resistance by about 85%, which maytranslate to about a 35% reduction in stage resistance for a 3-inputNAND gate, and about a 12% increase in frequency at isopower for aninverter with a 3-way fanout.

Referring to FIG. 7, remaining portions of the dielectric layer 121 areremoved using the same or a similar etch process as that described inconnection with the removal of portions of the dielectric layer 121 toform the trench 124. The removal of the remaining portions of thedielectric layer 121 exposes portions of the etch stop layer 103 thatwere under the dielectric layer 121. Referring to FIG. 8, exposedportions of the etch stop layer 103 are removed using, for example, achlorine-based plasma or fluorine-based plasma. The portions of the etchstop layer 103 under the interconnect structure 12 are not removed.There is no capacitance penalty by removing the exposed portions of theetch stop layer 103.

Referring to FIG. 9, a dielectric layer 121′ is formed on the dielectriclayer 111 to replace the removed dielectric layer 121 and fills in gapsaround the interconnect structure 12 and the remaining portions of theetch stop layer 103. According to an embodiment, the dielectric layer121′ comprises the same or similar material as that of the dielectriclayers 101, 111 and 121. The dielectric layer 121′ is deposited using,for example, PVD, CVD, ALD, PECVD, RFCVD, MLD, MBD, LSMCD, and/orsputtering, followed by a planarization, such as, for example, CMP toplanarize the dielectric layer 121′ with the interconnect structure 12.

As shown by the top circled portion in FIG. 9, the etch stop layer 103between the bottom surface of the fill layer in trench 124 and thedielectric layer 111 prevents the material of the conductive fill layer125 from diffusing into the dielectric layer 111. In addition, thetrench 124 has a uniform depth measured from a top surface of the filllayer 125 to the top surface of the etch stop layer 103. Like in FIGS.6-8, the bottom circled portion in FIG. 9 illustrates the lack of abarrier layer and a liner layer at the bottom of the via V_(x), wherethe fill layer 125 is deposited directly on the fill layer 105. The lackof the liner and barrier layers at the bottom of the via V_(x) lowersthe resistance as compared to when the liner and barrier layers arepresent, thereby improving device performance. The interconnect 12surrounded by the dielectric layer 121′ and the dielectric layer 121′can form at least part of an upper metallization level (M_(x+1)).

Referring to FIG. 10, following the processing from FIG. 3, in asemiconductor device 200, the trench 124 and opening 128 are lined witha barrier layer 226. The barrier layer 226 can have the same material asor similar material to the barrier layer 126, and can be depositedusing, for example, a deposition technique, such as ALD, CVD or PVD. Thebarrier layer 226 is conformally or non-conformally formed on a topsurface of the dielectric layer 121, and on sidewalls and bottomsurfaces of the trench 124 and opening 128, including exposed surfacesof the capping layer 102, etch stop layer 103 and dielectric layers 121and 111, and on the exposed top surfaces of the interconnect I1 (e.g.,on fill layer 105).

Referring to FIG. 11, horizontal portions of the barrier layer 226 areremoved in an etch back process. The etch back process can be performedusing, for example, a directional dry etch process comprising argonsputtering. The etch back process removes portions of the barrier layer226 from top surfaces of the dielectric layer 121, the top surface ofthe etch stop layer 103 on the dielectric layer 111, and the from topsurface of the interconnect I1, including the fill layer 105. Althoughthe barrier layer 226 is removed from the top surface of the etch stoplayer 103 on the dielectric layer 111, the etch stop layer 103, which isformed of a metallic material, remains. As a result, once a conductivefill layer (e.g., layer 225) is deposited in the trench 124 on the etchstop layer 103, the metallic etch stop layer 103 can be a diffusionbarrier to prevent diffusion of the material of fill layer (e.g., layer125) into the dielectric layer 111.

Referring to FIG. 12, a liner layer 227 is deposited on the barrierlayer 226, on the etch stop layer 103 and on the top surface of theinterconnect I1 (e.g., on the fill layer 105). The liner layer 227 isalso deposited on the exposed top surface of the dielectric layer 121.The liner layer 227 can have the same material as or similar material tothe liner layer 127, and can be deposited using, for example, aconformal deposition technique, such as ALD or CVD.

Referring to FIG. 13, the remaining portions of the trench 124 andopening 128 are filled with conductive fill layer 225, similar to filllayer 125. For example, the fill layer 225 can have the same material asor similar material to the fill layer 125. The fill layer 225 isdeposited on an exposed surface of the liner layer 227 using depositiontechniques, including, but not necessarily limited to, PVD, CVD, ALD orsputtering.

Following deposition of the fill layer 225, a planarization process,such as, for example, CMP, is performed to remove portions of the filland liner layers 225 and 227 on the top surface of the dielectric layer121 and extending out of the trench 124 to planarize an upper surface ofthe device.

The circled portion in FIG. 13 illustrates the lack of a barrier layerat the bottom of the via V2 _(x), where the fill layer 225 is depositeddirectly on the liner layer 227. Even with the presence of the linerlayer 227, the removal of barrier layer from the bottom of the via V2_(x) lowers the resistance as compared to when the barrier layer ispresent, thereby improving device performance.

Referring to FIG. 14, following the same or similar processing to thatdescribed in connection with FIG. 7, remaining portions of thedielectric layer 121 are removed, which exposes portions of the etchstop layer 103 that were under the dielectric layer 121. Referring toFIG. 15, following the same or similar processing to that described inconnection with FIG. 8, the exposed portions of the etch stop layer 103are removed. The portions of the etch stop layer 103 under theinterconnect structure 13 are not removed. There is no capacitancepenalty by removing the exposed portions of the etch stop layer 103.

Referring to FIG. 16, following the same or similar processing to thatdescribed in connection with FIG. 9, a dielectric layer 221 is formed onthe dielectric layer 111 to replace the removed dielectric layer 121 andfills in gaps around the interconnect structure 13 and the remainingportions of the etch stop layer 103. According to an embodiment, thedielectric layer 221 comprises the same or similar material as that ofthe dielectric layers 101, 111 and 121. The dielectric layer 221 isdeposited using, for example, PVD, CVD, ALD, PECVD, RFCVD, MLD, MBD,LSMCD, and/or sputtering, followed by a planarization, such as, forexample, CMP to planarize the dielectric layer 221 with the interconnectstructure 13.

As shown by the top circled portion in FIG. 16, the etch stop layer 103between the bottom surface of the liner layer 227 in trench 124 and thedielectric layer 111 prevents the material of the conductive fill layer225 from diffusing into the dielectric layer 111. In addition, thetrench 124 has a uniform depth measured from a top surface of the filllayer 225 to the top surface of the etch stop layer 103. Like in FIGS.13-15, the bottom circled portion in FIG. 16 illustrates the lack of abarrier layer, and only the liner layer 227 at the bottom of the via V2_(x), where the liner layer 227 is deposited directly on the fill layer105 with no intervening barrier layer, and the fill layer 225 isdeposited directly on the liner layer 227. The lack of the barrier layerat the bottom of the via V_(x) lowers the resistance as compared to whenthe barrier layer is present, thereby improving device performance. Theinterconnect 13 surrounded by the dielectric layer 221 and thedielectric layer 221 can form at least part of an upper metallizationlevel (M_(x+1)).

Although illustrative embodiments of the present invention have beendescribed herein with reference to the accompanying drawings, it is tobe understood that the invention is not limited to those preciseembodiments, and that various other changes and modifications may bemade by one skilled in the art without departing from the scope orspirit of the invention.

We claim:
 1. A method for manufacturing a semiconductor device,comprising: forming an interconnect in a first dielectric layer; forminga second dielectric layer on the first dielectric layer; forming an etchstop layer on the second dielectric layer; forming a third dielectriclayer on the etch stop layer; forming a trench in the third dielectriclayer; forming an opening in the second dielectric layer; depositing abarrier layer in the trench and the opening and on a top surface of theinterconnect; removing the barrier layer from the top surface of theinterconnect and from a bottom surface of the trench; and depositing aconductive fill layer in the trench and in the opening and on theinterconnect; wherein a bottom surface of the trench comprises the etchstop layer.
 2. The method according to claim 1, wherein the conductivefill layer is deposited on the top surface of the interconnect.
 3. Themethod according to claim 1, wherein the conductive fill layer isdeposited on the etch stop layer.
 4. The method according to claim 3,wherein the etch stop layer comprises a conductive material.
 5. Themethod according to claim 4, wherein the etch stop layer comprises oneof tantalum (Ta), tantalum nitride (TaN), Ta/TaN, Ta/Ruthenium (Ru),Ta/Cobalt (Co), TaN/Ru, TaN/Co, Ta/TaN/Ru, and Ta/TaN/Co.
 6. The methodaccording to claim 1, wherein: the conductive fill layer in the trenchforms at least part of a second interconnect; and the conductive filllayer in the opening forms at least part of a via connecting the secondinterconnect to the interconnect.
 7. The method according to claim 1,further comprising: removing the third dielectric layer, wherein theremoving of the third dielectric layer exposes portions of the etch stoplayer; removing the exposed portions of the etch stop layer; anddepositing a fourth dielectric layer in place of the removed thirddielectric layer.
 8. The method according to claim 1, wherein followingthe removing, portions of the barrier layer remain on side surfaces ofthe trench and the opening.
 9. The method according to claim 1, furthercomprising depositing a liner layer on the barrier layer in the trenchand in the opening and on the top surface of the interconnect.
 10. Themethod according to claim 9, further comprising removing the liner layerfrom the top surface of the interconnect and from the bottom surface ofthe trench.
 11. The method according to claim 1, further comprisingdepositing a liner layer in the trench and in the opening and on theinterconnect after the removing of the barrier layer from the topsurface of the interconnect and from the bottom surface of the trench.12. The method according to claim 11, wherein the liner layer isdeposited on remaining portions of the barrier layer formed on sidesurfaces of the trench and of the opening.
 13. The method according toclaim 11, wherein the liner layer is deposited on the top surface of theinterconnect.
 14. The method according to claim 13, wherein theconductive fill layer is deposited on the liner layer.
 15. Asemiconductor device, comprising: a first interconnect disposed in afirst dielectric layer; a second dielectric layer disposed on the firstdielectric layer; a third dielectric layer disposed on the seconddielectric layer; a second interconnect disposed in a trench in thethird dielectric layer, wherein the second interconnect comprises afirst portion of a conductive fill layer, wherein a bottom surface ofthe trench comprises an etch stop layer comprising a conductivematerial, and wherein the etch stop layer is disposed between the firstportion of the conductive fill layer and the second dielectric layer;and a via disposed in the second dielectric layer, wherein the viacomprises a second portion of the conductive fill layer and connects thesecond interconnect to the first interconnect, and wherein the secondportion of the conductive fill layer is disposed on the firstinterconnect.
 16. The semiconductor device according to claim 15, thesecond portion of the conductive fill layer is disposed on a top surfaceof the first interconnect.
 17. The semiconductor device according toclaim 15, wherein the etch stop layer contacts the first portion of theconductive fill layer and the second dielectric layer.
 18. Thesemiconductor device according to claim 15, further comprising a linerlayer disposed on a top surface of the first interconnect between thesecond portion of the conductive fill layer and the top surface of thefirst interconnect.
 19. A method for manufacturing a semiconductordevice, comprising: forming an etch stop layer on a first dielectriclayer; forming a second dielectric layer on the etch stop layer; etchingthe second dielectric layer down to the etch stop layer to form a trenchin the second dielectric layer, wherein a bottom surface of the trenchcomprises the etch stop layer; etching the first dielectric layer toform an opening in the first dielectric layer under the trench, whereinthe etching of the first dielectric layer exposes a top surface of aninterconnect under the opening; depositing a barrier layer in the trenchand in the opening and on the top surface of the interconnect; removingthe barrier layer from the top surface of the interconnect and from abottom surface of the trench; and depositing a conductive fill layer inthe trench and in the opening and on the interconnect.
 20. The methodaccording to claim 19, wherein the conductive fill layer is deposited onthe top surface of the interconnect.